Lab Companion Rapid Temperature Change Test Chamber – Exclusive for Semiconductor Chip Testing

Product Positioning: Exclusive for Semiconductor Chip Testing, Adapt to Extreme Temperature Changes from -70℃ to +150℃

Nowadays, semiconductor chips are accelerating iteration towards high integration, high computing power and miniaturization. The reliability test standards for high-end chips (including 5G communication chips, automotive-grade chips, radio frequency chips, etc.) continue to upgrade, imposing extremely stringent requirements on the extreme temperature change adaptability and temperature control accuracy of test equipment. Such high-end chips need to undergo hundreds of temperature change cycle tests in the ultra-wide temperature range of -70℃ to +150℃, simulating extreme working environments to accurately screen potential defects such as bonding wire fatigue, package delamination and performance attenuation, ensuring the long-term operational stability of chips.

However, conventional rapid temperature change equipment on the market generally has shortcomings such as insufficient temperature range coverage, low temperature control accuracy and poor scenario adaptability, making it difficult to meet international authoritative test standards such as JEDEC JESD22-A104, which directly restricts the R&D iteration and mass production progress of semiconductor chips. Focusing on the environmental testing equipment field and targeting industry pain points accurately, Lab Companion has launched an exclusive rapid temperature change test chamber for semiconductor chips. With its ultra-wide temperature range of -70℃ to +150℃ and high-precision temperature control performance, it perfectly adapts to the stringent test requirements of various semiconductor chips.

Customized Core Parameters, Precisely Matching the Rigid Needs of Semiconductor Testing

Lab Companion special rapid temperature change chamber for semiconductors is polished with all-dimensional core parameters around the characteristics of semiconductor chip testing, taking into account stability, accuracy and practicality, and fully conforms to the test standards of high-end chips:

• Ultra-wide Temperature Range Coverage: The basic temperature range covers -70℃ to +150℃, and can be flexibly expanded to -70℃ to +220℃. It is fully suitable for multiple scenarios such as -40℃~+150℃ cycle test of automotive-grade chips, ultra-low temperature test of radio frequency chips, and high-temperature aging test of advanced packaging chips, with no shortcomings in temperature range adaptation.

• Adjustable Temperature Change Rate + High-precision Temperature Control: The temperature change rate is freely adjustable from 5 to 20℃/min. Low-speed temperature change can be set for precision chips to avoid damage to the internal structure of chips caused by rapid temperature change; the temperature control accuracy reaches ±0.3℃, and the temperature uniformity in the chamber is ≤±0.5℃, fully in line with the international standard of JEDEC JESD22-A104. It can accurately capture the subtle performance fluctuations of chips during temperature change, ensuring the authenticity, reliability and traceability of test data.

• Exclusive Protection Design: Equipped with nitrogen replacement function, it can accurately control the low-oxygen environment in the chamber, effectively avoiding problems such as oxidation, condensation and corrosion during chip testing, protecting precision chips in all directions and ensuring the smooth progress of the test process.

Special Scenario-based Design, Adapting to Diverse Semiconductor Test Conditions

Based on the special process requirements of semiconductor chip testing, Lab Companion has created a full-process customized service, optimized the equipment structure and functional configuration, solved the industry problem of poor adaptability of traditional equipment, and covered multi-scenario test needs:

• Linkage Test Adaptation: Optimize the internal layout of the chamber and reserve standardized probe station interfaces, which can be directly connected to the chip test probe station to realize linkage testing without additional equipment modification, solving the pain points of incompatible interfaces and unreasonable layout, simplifying the test process and improving test continuity.

• Anti-interference Optimization: Built-in electromagnetic shielding module, which effectively isolates external electromagnetic interference, ensures stable signal transmission during chip testing, eliminates external factors interfering with test data, and guarantees accurate and error-free test results.

• Flexible Models + Intelligent Control: Launch compact small-capacity models such as 200L and 300L, suitable for small-batch R&D testing and sample verification of semiconductor chips; equipped with a 7-inch intelligent touch screen, supporting the storage of more than 200 sets of test programs, enabling rapid switching of test parameters within 45 seconds, adapting to the test needs of chips of different specifications and models, and greatly improving test efficiency.

Verified by Leading Enterprises, Helping Reduce Costs and Improve Efficiency in Chip R&D

With its robust performance, Lab Companion special rapid temperature change chamber for semiconductors has become the core test equipment for leading semiconductor enterprises in China and globally such as Hisilicon and SMIC, and has implemented multiple measured cases, effectively helping enterprises solve test problems and speed up R&D and mass production:

After a 5G chip enterprise was equipped with Lab Companion equipment, the full temperature range cycle test time from -40℃ to +150℃ was shortened to 30 minutes, the test efficiency was increased by 4 times, and the original 4-day test task could be completed in 1 day. The temperature control deviation was ≤±0.3℃, the test data fully met the standards, and it passed the JEDEC international certification at one time, avoiding rework loss and reducing test costs.

An automotive-grade MCU chip enterprise selected the 20℃/min rapid temperature change model, which can complete temperature switching in 2 minutes, with the temperature control accuracy stably maintained at ±0.3℃. Combined with the nitrogen replacement function to eliminate condensation, the test cycle was completed 15 days in advance, helping the chip pass the AEC-Q100 automotive-grade certification smoothly, and the chip package defect rate dropped below 0.05%, greatly improving product yield.

Supported by Authoritative Standards, Escorting Global Layout of Products

Lab Companion semiconductor rapid temperature change chamber strictly complies with many international and China’s authoritative test standards such as IEC, GB/T and JEDEC, and has passed CNAS calibration certification. The equipment test data is globally recognized and can be directly used for product compliance certification and overseas market access audit, helping semiconductor products go global easily.

At the same time, Lab Companion has built a global service system. Relying on global service outlets, it provides full-cycle technical support including 2-hour rapid response and dedicated on-site technical assignment. It is equipped with a professional semiconductor test technical team, which can customize personalized test solutions according to customers' exclusive test needs, helping semiconductor enterprises improve product reliability and seize core competitiveness in the global market.